With its excellent thermal conductivity, Hydronaut can also be used in the overclocking area, but it was specially developed for users with large heat sinks who are looking for a high-quality product with an attractive price / performance ratio for their water cooling system.
Suitable for overclocking
Excellent thermal conductivity
No curing
Silicone free
Not electrically conductive
The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling area.The Hydronaut Paste offers optimal thermal conductivity for large-area heat transfer media, as can be found particularly in the water cooling area.
The Hydronaut thermal paste has a silicone-free carrier structure. This has the advantage that it has a very low weight and a high degree of flexibility, which means that the heat-conducting paste can be applied very easily.
Hydronaut achieves optimal values ??for use on medium and large-area heat transfer media. The product manufactured according to the ROHS standard is an easy-to-apply heat conducting medium for demanding users.
Thermal conductivity: 11.8 W / mk
Thermal resistance: 0.0076 K / W
Electrical conductivity: * 0 pS / m
Viscosity: 140-190 Pas Spec.
Weight: 2.6g / cm3
Temperature: -200 ° C / +350 ° C
Content: 1g
Model: TG-H-001-RS
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- Thermal paste ideal for optimizing thermal conductivity
- Thermal conductivity: 11.8 W / mk
- Thermal resistance: 0.0076 K / W
- Electrical conductivity: * 0 pS / m
- Content: 1g
- Thermal conductivity: 11.8 W / mk|Thermal resistance: 0.0076 K / W|Electrical conductivity: * 0 pS / m|Content: 1g
Joshua Moore (verified owner) –
Futuristic, high-quality technology arrives fast.